MediaTek’s next flagship chip, Dimensity 9500, is gearing up for a 2025 release. According to Digital Chat Station, a Chinese insider, this powerhouse will be built using TSMC’s advanced N3P 3-nanometer process. This tech upgrade is expected to boost performance by 5% over the current N3E process used in Dimensity 9400 and 9400+.
CPU Architecture
The Dimensity 9500 is set to feature an all-big-core CPU design. Digital Chat Station reveals it will have 1x Travis, 3x Alto, and 4x Gelas cores. ARM’s roadmap, as reported by WikiChip, suggests Travis and Gelas might be new Cortex-X and Cortex-A7xx cores, handling heavy tasks. Alto is likely a new Cortex-A5xx core, possibly an improved A7xx variant, managing secondary tasks.
Memory and Storage
The chip will come with an L3 cache for faster CPU data access and a 10 MB System-Level Cache. This cache acts as a buffer between the CPU, GPU, and RAM, speeding up data retrieval. It will also support LPDDR5X RAM at speeds of up to 10,667 Mbps and UFS 4.1 storage.
GPU and NPU
The Dimensity 9500 is expected to feature the Immortalis-Drage GPU with improved Ray Tracing tech. This means more accurate lighting effects and lower power use. The NPU, or AI processing unit, is likely to be NPU 9.0, capable of 100 TOPS. That’s double the 50 TOPS of Dimensity 9400.
Clock Speed and Launch
Digital Chat Station claims the Dimensity 9500 could reach clock speeds over 4.0 GHz, rivaling Qualcomm’s current Snapdragon 8 Elite, which tops out at 4.32 GHz. The Dimensity 9500 is slated for release in October or November 2025.